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Home » Products » Organofunctional Silanes » Epoxy Silane » 2,4,6,8-Tetramethyl-2,4,6,8-tetrakis[3-(oxiranylmethoxy)propyl ]cyclotetrasiloxane CAS:60665-85-2

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2,4,6,8-Tetramethyl-2,4,6,8-tetrakis[3-(oxiranylmethoxy)propyl ]cyclotetrasiloxane CAS:60665-85-2

Capatue® CSLX-D4E4 is a tetrafunctional epoxy-based cyclotetrasil with a cyclotetrasiloxane (D4) backbone, where each silicon atom is bonded to a methyl group and an epoxy propoxypropyl group, combining the stabf the cyclic structure with the high reactivity of epoxy groups. The four aliphatic epoxy groups can enhance the adhesion properties and cross-linking strength of products, providinglti-epoxy reactivity, high cross-linking density, and fast curing, allowing for curing via amines, anhydrides, or cationic initiators; while thcyclic siloxane structure offers flexibility and resistance to high and low temperatures, improving the toughness and thermal resistance of composites. The combined effect of these two components results in superior composite performancombining the excellent heat resistance of siloxanes with a high Tg (glass transition temperature). Meanwhile, as a cyclic siloxane structure product, CSLX-D4E4 pses the core advantage of extremely low curing shrinkage.
 
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  • CSLX-D4E4

  • CSLX-D4E4

  • 60665-85-2

Abstract
Capatue® CSLX-D4E4 is a tetrafunctional epoxy-based cyclotetrasil with a cyclotetrasiloxane (D4) backbone, where each silicon atom is bonded to a methyl group and an epoxy propoxypropyl group, combining the stabf the cyclic structure with the high reactivity of epoxy groups. The four aliphatic epoxy groups can enhance the adhesion properties and cross-linking strength of products, providinglti-epoxy reactivity, high cross-linking density, and fast curing, allowing for curing via amines, anhydrides, or cationic initiators; while thcyclic siloxane structure offers flexibility and resistance to high and low temperatures, improving the toughness and thermal resistance of composites. The combined effect of these two components results in superior composite performancombining the excellent heat resistance of siloxanes with a high Tg (glass transition temperature). Meanwhile, as a cyclic siloxane structure product, CSLX-D4E4 pses the core advantage of extremely low curing shrinkage.

Identification
Name:2,4,6,8-Tetramethyl-2,4,6,8-tetrakis[3-(oxiranylmethoxy)propyl ]cyclotetrasiloxane
 
Molecular Formula:C28H56O12Si4
Molecular Weight: 697.079
CAS Registry Number: 60665-85-2
EINECS: 262-360-7

Properties
Density: 1.08
Refractive index: 1.4545

Application
1. As an epoxy resin modifier, imparting excellent corrosion resistance, anti-fouling properties, hyrophobicity, adhesion, mechanical properties, and heat resistance to epoxy resin systems.
2. Synergistically modifying phenolic epoxy resins with phosphorus-containing phen (DOPO-P) to enhance their heat resistance, mechanical properties, and flame retardancy efficiency, achieving halogen-free, high-efficiency flame retardancy.
3. As a raw material for fabric finihing agents, reacting the four epoxy groups with N,N-dimethyl-1,3-propanediamine for ring-opening, followed by acidification and reaction with end-epsilicone oil or end-epoxy polyether silicone oil to obtain high-end fabric finishing agents. The treated fabrics are soft, breathable, and have low yellowing, with improved elastic ery and loft.
4. As a raw material for preparing linear epoxy-modified polysiloxanes, allowing for the precise synthesis of epoxy polysiloxanes with controllable epoxy content djusting the feed ratio of the tetra-epoxy cyclotetrasiloxane monomer.
5. As a raw material for UV-curable silicone ahesives. (1) Using the silicone structure as the main chain segment of the resin to fully utilize the silicone's resistance to wet heat and thermal shock; (2) Utilizing the ring-openingn of acrylic acid with epoxy groups to introduce acrylic double bonds as curing functional groups, while also adding a hydroxyl group; the presence of the hydroxyl group can interact pally or chemically with hydroxyl groups on the surface of the substrate, significantly improving the adhesive performance of the glue; (3) The acrylic-modified D4E acting as a tetrafunctional cross-linker, can effectively enhance the strength of the glue, thereby improving its overall performance.
6. As a raw material for adhesives toelectronic semiconductor devices. Adhesives prepared by polymerizing with phenolic hydroxyl cyclotetrasiloxanes for use in optoelectronic semiconductor devices exhibit characteris zero curing shrinkage, excellent adhesion, heat resistance, and moisture resistance; polymerizing with linear siloxanes containing epoxy groups at both ends can prepare a fiber optic array adhesith low refractive index, good reflow resistance, and heat resistance.

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